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GP2W3120YP0F GP2W3120YP0F irda compliant transceiver module 9.6 kb/s to 4 mb/s (fir) low profile low consumption current applications 1. mobile equipment (cellular phone, pager, smart phone, pdas, portable printer, etc. ) 2. digital imaging equipment (digital camera, photo imaging printer) 3. pos equipment 4. personal computers 5. personal information tools notice the content of data sheet is subject to change without prior notice. in the absence of confirmation by device specification sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the latest device specification she ets before using any sharp device. sheet no.: e3-a00802en date apr.02.2007 ?sharp corporation 1 description the GP2W3120YP0F is an infrared transceiver module for irda ver. 1.4 (fir). the transceiver consisits of a pin-photo diode, infrared emitter and control ic in a single package. this device have remote control transmission function. features 1. compliant with the irda 1.4 (fir) transmission speed : 9.6 kb/s to 4 mb/s transmission distance : 20 cm 2. small package l 7.16 w 2.73 h 1.82 mm 3. peak emission wavelength : 890 nm (built-in shared single led for rc and irda) 4. side view type 5. soldering reflow type 6. shield type 7. low consumption current due to shutdown function (consumption current at shutdown mode : max. 1.0 a) 8. operates from 2.7 to 3.3 v 9. with remote control function 10. with lp/hp mode switching function 11. with v io terminal agency approvals/compliance 1. compliant with iec60825-1 class 1 eye safety standard 2. compliant with rohs directive (2002/95/ec) 3. content status of six substances specified in ? management methods for control of pollution caused by electronic information products regulation ? (popular name : china rohs ) (chinese : ? ? ?? ) ; refer to page 14 4. lead (pb) free device
GP2W3120YP0F block diagram outline dimensions (unit : mm) product mass : approx. 0.05g amplifier receive detector driver agc logic current controlled driver leda txd-lp txd-hp rxd sd v cc v io gnd terminal symbol led anode leda transmitter data input lp txd-lp transmitter data input hp txd-hp receiver data output rxd shutdown sd supply voltage v cc logic i/o levels v io ground gnd shield ground sgnd sheet no.: e3-a00802en 2 1) area: au plating 2) unspecified tolerance shall be 0.2 mm 3) adhesion of resin to the terminal area shall be allowed max. 0.2 mm.
GP2W3120YP0F : solder paste area (unit : mm) recommended pcb foot pattern recommended size of solder creamed paste (reference) dimensions are shown for reference. please open the solder mask as below so that the size of solder creamed paste for this device before reflow soldering must be as large as one of the foot pattern land indicated for reference. dimensions are shown for reference (unit:mm) terminal symbol led anode leda transmitter data input lp txd-lp transmitter data input hp txd-hp receiver data output rxd shutdown sd supply voltage v cc logic i/o levels v io ground gnd shield ground sgnd sheet no.: e3-a00802en 3
GP2W3120YP0F absolute maximum ratings *1 pulse operation (fir 4 mb/s) *2 soldering reflow time : 10 seconds symbol rating unit supply voltage v cc -0.3 to 6.0 v led supply voltage v led -0.3 to 3.6 v transmission data input lp txd-lp -0.3 to v cc +0.3 v transmission data input hp txd-hp -0.3 to v cc +0.3 v shut down sd -0.3 to v cc +0.3 v logic i/o levels v io -0.3 to v cc +0.3 v *1 peak forward current i fm 330 ma operating temperature t opr -25 to +85 ) sheet no.: e3-a00802en 4
GP2W3120YP0F *3 refer to fig. 2, 3 *4 refer to fig. 4,5,6 electro-optical characteristics (t opr =25 5 , v cc =3.0v unless otherwise specified) symbol rating min. typ. max. unit sir mode i cc-sir D 0.45 0.6 ma fir mode i cc-fir D 1.2 1.55 ma sir mode i cc-rsir D 0.65 D ma fir mode i cc-rfir D 1.3 D ma v oh i oh =0.3ma *3 v io -0.5 v io -0.3 v io +0.3 v v ol i ol =1ma *3 DD 0.6 v t r DD 50 ns t f DD 50 ns t w1 1 D 24 s t w2 1 D 4 s t w3 67 D 195 ns t w4 190 D 320 ns l21 DD cm e e1 DD 8.16 w/cm 2 e e2 DD 20.4 w/cm 2 e e3 500 DD mw/cm 2 t l DD 500 s t sdw no input signal DD 1ms i isd v ihsd =v cc , v ilsd =gnd -0.1 0 +0.1 a v ihsd shutdown mode v cc -1.2 D v cc v v ilsd normal mode DD 0.5 v t j br=4mb/s, t a =25 D 30 60 ns low power i led-lp 100 150 200 ma high power i led-hp 150 250 330 ma t r DD 40 ns t f DD 40 ns p t a =25 870 890 900 nm led(on),1.5 Q v io Q 1.8v 1.4 D v cc v led(on),1.8 v io Q v cc 1.6 D v cc v t opwm txd pin stuck high 30 D 300 s D a txd-lp txd-hp low level input current i iltxd t a =25 D D a D D ,t a =25 *4 i e-hp v led =3.3v,r led =4.3 =15 ,t a =25 *4 D D ?Q 15 t w2 ,e e1 ;br=115.2kb/s, ?Q 15 t w3 ,e e2 ;br=4mb/s(single), ?Q 15 t w4 ,e e2 ;br=4mb/s(double), ?Q 15 t a =25 except for pulse during a half of preamble low level pulse width current consumption at no input signal current consumption at receiving current consumption at transmitting current consumption at shutdown mode receiver D D *5 55 ma no input signal, v ilsd =0v output terminal open v ilsd =0v output terminal open v ihtxd-lp =high or, v ihtxd-hp =high, v ilsd =0v 1.0 a no input signal, v ihsd =v cc -1.2v output terminal open i cc-s i e-lp v led =3.3v,r led =4.3 ?Q 15 ,t a =25 *4 fall time receiver latency receiver wakeup time sd input current jitter low power high power rise time br=4mb/s,v led =3.3v,t a =25 *4 v iltxd led(off) txd-lp txd-hp high level input current i ihtxd t a =25 D D D 5
GP2W3120YP0F truth table h:high, l:low lp : low power ie, hp : high power ie (note) don?t input transmitter lp high signal and hp high signal at the same time in transmitter mode. recommended operating conditions *5 when you make duty 25 % of signal emit light continuously, please use continuation luminescence time in less than 10 seconds. *rxd equivalent circuit tr1 tr2 rxd 600k typ. sd sw txd-lp txd-hp led receiver tr1 tr2 rxd h off l l off don't care off off h(pull-up) lp l on h l lp don't care off on l(echo) hp l on l h hp don't care off on l(echo) l on l l off irda signal off on l l on l l off no signal on off h transmitter mode shutdown receiver *txd equivalent circuit 400k typ. sw txd-lp txd-hp (t a =25 ) sheet no.: e3-a00802en 6 parameter symbol conditions rating unit supply voltage v cc 2.7 to 3.3 v led supply voltage v led r led =4.3 2.7 to 3.6 v operating temperature t opr *5 -25 to +85 data rate br 9.6k to 4m b/s logic i/o levels v io 1.5 to v cc v
GP2W3120YP0F fig.1 recommended external circuit leda txd -lp txd -hp rxd sd v cc v cc v io gnd c x3 c x2 c x1 c x4 r 1 9 sgnd v led r led (note1) components choose the most suitable c x1 , c x2 , c x3 , c x4 according to the noise level and noise frequency of power supply. (nore2) in order to guarantee (10 mw/sr), v led is required 3.3 v (r led = 4.3 ), v led is required 2.85 v (r led = 2.4 ). sheet no.: e3-a00802en 1234 5 67 8 7 recommended values 4.7 f(ceramic)(note1) 0.47 f(ceramic)(note1) 0.47 f(ceramic)(note1) 10 f(ceramic)(note1) 4.7 1/4w 4.3 (v led =3.3v) 1/10w 2.4 (v led =2.85v) c x4 r 1 (1/16w) r led (note2) components c x1 c x2 c x3
fig.2 output waveform specification(receiver side) t f t w t r 90% 50% 10% v oh v ol transmitter * l e e : light detector face illuminance<10 lx : indicates horizontal and vertical directions. GP2W3120YP0F oscilloscope t 1 radiant intensity t 2 fig.3 standard optical system(receiver side) GP2W3120YP0F * transmitter shall use the standard transmitter ( p = 890 nm typ.) which is adjusted the radiation inte nsity at 3.6 mw/sr (at 9.6 to 115.2 kb/s), 9 mw/sr (at 4 mb/s). data rate t 1 t 2 t 2 /t 1 radiant intensity 9.6kb/s 103 s19.5 s 3/16 3.6mw/sr 115.2kb/s 8.68 s1.63 s3/16 40mw/sr 4mb/s 500ns 125ns 1/4 9mw/sr 4mb/s 500ns 250ns 1/2 9mw/sr sheet no.: e3-a00802en 8
t f t r i e fig.4 output waveform specification(transmitter side) fig.5 standard optical system(transmitter side) : indicates horizontal and vertical directions. GP2W3120YP0F detector for radiant intensity measuring fig.6 recommended circuit of transmitter side GP2W3120YP0F txd-lp txd-hp GP2W3120YP0F c=10 f 19.5 s (9.6kb/s) 1.63 s (115.2kb/s) 125ns (4mb/s, single) 250ns (4mb/s, double) br=9.6kb/s br=115.2kb/s br=4mb/s v led =3.3v r led =4.3 v cc =3.0v 90% 10% sheet no.: e3-a00802en 9
GP2W3120YP0F logic i/o levels v io (v) high level output voltage v oh (v) (typ.) fig.7 high level output voltage(v oh ) vs logic i/o levels(v io ) sheet no.: e3-a00802en 1234 1 2 3 4 0 notes (1) when the system (program) is designed, the turn around time shall be secured by considering 500 s or more that is specified to irda. then, this turn around time means the time when this device does not temporarily detect the signal light, since the transmitted light form the transceiver reaches the detector side of the transceiver. (2) as it is necessary 1 ms or more (at ta =25 c, no input signal) to return from shut-down mode to ready- operation mode, please consider this point at the system (program) designing. also, please confirm thoroughly the operation in actual application. (3) when there is much external disturbing light source is located near this transceiver and the detector face resceiver much external disturbing light, there is case that the pulse other than signal output is generated as noise on output terminal of this transceiver. please consider the lay-out and structure to reduce disturbing light on the detector face. (4) in case that this sensor is adopted in ir communication system, please use it according to the signal method which is specified by [serial infrared physical layer link specification version 1.4] published by infrared data association. false operation may happen if the different signal method is used. (5) in circuit designing, make allowance for the degradation of light emitting diode output that results from long continuous operation. ( 50 % degradation/5 years) 10
GP2W3120YP0F 1. in case of solder reflow 2. other precautions 3. soldering soldering method 1 to 5 /s 1 to 5 /s max120s max10s max70s please carry out only two times soldering at the temperature and the time within the temperature profile as shown in the figure below. reflow interval shall be within 3 days under conditions, 10 to 30 , 70%rh or less. an infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin. so keep the package temperature within that specified in item 1. also avoid immersing the resin part in the solder. even if within the temperature profile above, there is the possibility that the gold wire in package is broken in case that the deformation of pcb gives the affection to lead pins. please use after confirming the conditions fully by actual solder reflow machine. ? soldering iron shall be less than 25w, and temperature of point of soldering iron shall use at 300 or less. ? soldering time shall be within 5s. ? soldered product shall treat at normal temperature. 200 max 165 25 max 260 sheet no.: e3-a00802en 11
GP2W3120YP0F package specification tape and reel package 2000 pcs/reel carrier tape structure and dimensions abcde f 16.00.3 7.50.1 1.750.1 8.00.1 2.00.1 4.00.1 gh i j k 1.5 +0.1 -0.0 7.450.1 0.320.05 2.10.1 2.80.1 sheet no.: e3-a00802en fe d g c b a i h k j 12 (unit : mm)
GP2W3120YP0F reel structure and dimensions direction of product insertion d e a b c g f pull out direction lens side abcd 3302 17.51.0 1001 130.2 efg 210.8 22.41.0 20.5 sheet no.: e3-a00802en dimension list 13 (unit : mm)
GP2W3120YP0F sheet no.: e3-a00802en 14 cleaning instructions solvent cleaning : solvent temperature 45 or less, immersion for 3 min or less ultrasonic cleaning : the effect to device by ultrasonic cleaning differs by cleaning bath size, ultrasonic power output, cleaning time, pcb size or device mounting condition etc. please test it in actual using condition and confirm that doesn't occur any defect before starting the ultrasonic cleaning. the cleaning shall be carried out with solvent below. recommended solvent materials : ethyl alcohol, methyl alcohol, isopropyl alcohol presence of odc etc. ? ? ? infrared data communication device ? ? ? category toxic and hazardous substances lead (pb) mercury (hg) cadmium (cd) hexavalent chromium (cr 6+ ) polybrominated biphenyls (pbb) polybrominated diphenyl ethers (pbde) this product shall not contain the following materials. and they are not used in the production process for this product. regulation substances : cfcs, halon, carbon tetrachloride, 1.1.1-trichloroethane (methylchloroform) specific brominated flame retardants such as the pbb and pbde are not used in this product at all. ? the rohs directive (2002/95/ec) this product complies with the rohs directive (2002/95/ec). object substances: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (pbb) and polybrominated diphenyl ethers (pbde) ? content of six substances specified in ? management methods for control of pollution caused by electronic information products regulation ? (chinese : ? ? ?? ) ? : indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement as described in sj/t 11363-2006 standard.
GP2W3120YP0F important notices the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. s harp takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of sharp's devices. contact sharp in order to obtain the latest device specifi- cation sheets before using any sharp device. sharp reserves the right to make changes in the specifications, characteristics, data, materials, str ucture, and other contents described herein at any time without notice in order to improve design or re liability. manufacturing locations are also subject to change without notice. observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following condi- tions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- office automation equipment --- telecommunication equipment [terminal] --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii) measures such as fail-safe function and redundant design should be taken to ensure reliability and safety w hen sharp devices are used for or in connection with equipment that requires higher reliability such as: --- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traffic signals --- gas leakage sensor breakers --- alarm equipment --- various safety devices, etc. (iii) sharp devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- space applications --- telecommunication equipment [trunk lines] --- nuclear power control equipment --- medical and other life support equipment (e.g., scuba). if the sharp devices listed in this publication fall within the scope of strategic products described in the foreign exchange and foreign trade law of japan, it is necessary to obtain approval to export such sharp devices. this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copy- right laws, no part of this publication may be repro- duced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. contact and consult with a sharp representative if there are any questions about the contents of this publication. sheet no.: e3-a00802en 15

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